High performance single stage, compact plasma cleaner suitable for R&D purposes
Features
- Simple and compact plasma surface treatment device
- RIE (Reactive Ion Etching) Plasma mode, with DP (Direct Plasma) mode as option
- Excellent electrode structure for plasma uniformity
- Simple touch panel system
Applications
- Plasma processing of CSP, BGA, COB substratum
- Removal of organic films and metal oxidized films
- Dry cleaning of printed circuit board
- Surfactant process LED assembly
- For R&D
| Models | PDC200 | PDC210 | PDC510 | |
| Plasma Mode | RIE (DP mode option) | RIE (DP mode option) | RIE / DP selectable | |
| Electrode Structure | Parallel flat stage plate | |||
| Vacuum Gauge | Capacitance manometer | |||
| High Frequency Output | Max 300W | Max 500W | Max 500W | |
| Oscillation Frequency | 13.56MHz Quartz oscillator | |||
| Output Setting Method | Manual setting on the LCD touch panel | |||
| Matching Method | Auto tuning | |||
| Controller | Programmable | |||
| Display | LCD touch panel | |||
| Chamber Size | W400 × D250 × H150 mm | W400 × D250 × H150 mm | W500 × D300 × H200 mm | |
| Stage Size | W250 × D170 mm | W250 × D170 mm | W410 × D210 mm | |
| Chamber Material | Aluminum | |||
| Reaction Gas | 2 systems (Argon, Oxygen) | |||
| Purge Gas | Nitrogen or dry air | |||
| Reaction Gas Flow Control | Flow meter | Mass flow controller | Mass flow controller | |
| Rotary Vacuum Pump (Optional) | ~345 l/min | ~345 l/min | ~500 l/min | |
| External Dimensions WxDxH | 540×600×600 mm | 540×600×600 mm | 700×700×700 mm | |
| Weight | ~100kg | ~105kg | ~180kg | |
| Power Source 50/60Hz | Single phase AC100V 15A | 3-phase AC200V~AC240V | 3-phase AC200V~AC240V | |
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